BS EN 60749-34-2004 半导体器件.机械和气候试验方法.动力循环
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Powercycling
【原文标准名称】:半导体器件.机械和气候试验方法.动力循环
【标准号】:BSEN60749-34-2004
【标准状态】:作废
【国别】:英国
【发布日期】:2004-06-22
【实施或试行日期】:2004-06-22
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:气候试验;试验条件;电子工程;电学测量;半导体器件;电子设备及元件;半导体;组件;电气工程;耐力;试验;定义;集成电路;机械试验;环境试验;负载改变
【英文主题词】:Climatictests;Components;Definition;Definitions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Failure;Integratedcircuits;Loadalternation;Mechanicaltesting;Powerelectronics;Resistance;Semiconductordevices;Semiconductors;Simulation;Testing;Testingconditions
【摘要】:Thistestmethodisusedtodeterminetheresistanceofasemiconductordevicetothermalandmechanicalstressesduetocyclingthepowerdissipationoftheinternalsemiconductordieandinternalconnectors.Thishappenswhenlow-voltageoperatingbiasesforforwardconduction(loadcurrents)areperiodicallyappliedandremovedcausingrapidchangesoftemperature.Thepowercyclingtestisintendedtosimulatetypicalapplicationsinpowerelectronicsandiscomplementarytohightemperatureoperatinglife(seeIEC60749-23).Exposuretothistestmaynotinducethesamefailuremechanismsasexposuretoair-to-airtemperaturecycling,ortorapidchangeoftemperatureusingthetwo-fluid-bathsmethod.Thistestcauseswear-outandisconsidereddestructive.NOTEItisnottheintentionofthisspecificationtoprovidepredictionmodelsforlifetimeevaluation.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:12P.;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.动力循环
【标准号】:BSEN60749-34-2004
【标准状态】:作废
【国别】:英国
【发布日期】:2004-06-22
【实施或试行日期】:2004-06-22
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:气候试验;试验条件;电子工程;电学测量;半导体器件;电子设备及元件;半导体;组件;电气工程;耐力;试验;定义;集成电路;机械试验;环境试验;负载改变
【英文主题词】:Climatictests;Components;Definition;Definitions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Failure;Integratedcircuits;Loadalternation;Mechanicaltesting;Powerelectronics;Resistance;Semiconductordevices;Semiconductors;Simulation;Testing;Testingconditions
【摘要】:Thistestmethodisusedtodeterminetheresistanceofasemiconductordevicetothermalandmechanicalstressesduetocyclingthepowerdissipationoftheinternalsemiconductordieandinternalconnectors.Thishappenswhenlow-voltageoperatingbiasesforforwardconduction(loadcurrents)areperiodicallyappliedandremovedcausingrapidchangesoftemperature.Thepowercyclingtestisintendedtosimulatetypicalapplicationsinpowerelectronicsandiscomplementarytohightemperatureoperatinglife(seeIEC60749-23).Exposuretothistestmaynotinducethesamefailuremechanismsasexposuretoair-to-airtemperaturecycling,ortorapidchangeoftemperatureusingthetwo-fluid-bathsmethod.Thistestcauseswear-outandisconsidereddestructive.NOTEItisnottheintentionofthisspecificationtoprovidepredictionmodelsforlifetimeevaluation.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:12P.;A4
【正文语种】:英语
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